Currently used on the lcd module frame plastic sealing material that there are two main categories, one box is UV curable adhesive, mainly used in the production of pieces of sheet curing methods on; other is thermally cured sealant, most Semi-automatic production line is mainly use this plastic box. The following description is represented by XN-5A thermosetting plastic box.
XN-5A used in the liquid crystal display industry has thirty years of history, and almost monopolized the LCD monitor sealing material nearly twenty years later with the development of large-size TFT, was the constant application of new materials to break . Even now, XN-5A the lcm module industry is still the most important sealing material.
XN-5A sample is tested thousands of times before they succeed in an electronic packaging materials, its unique three-component liquid mixed party and the resulting formation of three segments curing methods, packaging materials completely avoid contamination of the final product , is the last century's most successful electronic packaging materials.
XN-5A epoxy resin, catalyst and solvent mixture from the catalyst. Room temperature, the plastic box in the epoxy resin in liquid form, the catalyst is dissolved in a liquid solvent inside the uncured plastic boxes have a certain viscosity, but with continued stirring viscosity fall within a range. Inside the catalyst solvent evaporation starts at 80 degrees, but to evaporate completely, they should at 105 degrees, the temperature of the catalyst can be avoided during solvent evaporation absorb moisture; losing solvent crystallization catalyst will become crystal. Then it can be combined support from the upper and lower liquid crystal substrate can be reduced when heated plastic box behind the space inside the powder kept under pressure and do not deserve to make room for a long time after the softening powder in the heating kept under pressure to produce permanent deformation, thus changing the setting parameters of the liquid crystal cell gap. Melted at about 1180C liquid catalyst, as the temperature rises, the molecular dispersion of the epoxy group which, when heated to about 1420C, the epoxy resin in the catalyst, the high polymerization reaction to form glassy solid, the upper and lower substrates bonded together.
A liquid crystal panel section of the module (LCM): panel process can be divided into three stages, first semiconductor processes preceding (array), that is, the transistor is a thin film layer on the glass substrate made, compared with the middle of the liquid crystal filling assembly process (cell), that is, the color filter layer of glass and glass film transistors, together, poured into a liquid crystal intermediate.
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