LED bonding

The purpose of bonding the electrode lead to the LED chip, the finished product lead connections inside and outside work.COG LCD Display
LED is a gold ball bonding process welding and aluminum wire bonding two kinds. Right is aluminum wire bonding process, the first electrode of the LED chip first point on the pressure, and then the aluminum strands to the corresponding bracket above, the pressure on the second point after tearing aluminum. Gold ball bonding process is the first point in the press before burning balls, the rest is similar.
Bonding the LED packaging technology in the key, the main process is the need to monitor the bonding gold (aluminum) wire arch shape, spot shape, tension.
On the bonding process in-depth study into the various issues involved, such as gold (aluminum) wire material, ultrasonic power, pressure welding pressure, chopper (steel mouth) selection, chopper (steel mouth) trajectory and so on. (The figure is the same conditions, two different pressure out of the chopper pad microscopic photographs, both of which there are differences in the microstructure, thus affecting the quality of products.) Here we no longer tired.Lcd display modules