PI-oriented film factory adaptive testing methods and criteria

Viscosity: A, Test Method: Test viscometer viscosity measured PI-oriented film.
B, Criteria: The test results viscosity values ​​consistent with our suppliers to provide parameters.
Additive drying performance (pre-baking performance) A, Test Method: thickness requirements by the production process, the PI-oriented film coated on ITO conductive glass, provided by the supplier of heating and baking temperature and time parameters.
B, criteria: temperature and time in the parameter under, PI-oriented film additives completely dry.
Curing properties: A, test method: the PI oriented film has completely dried additive ITO conductive glass according to the production process requirements and vendor-supplied parameters required separately for curing.
B, criteria: cure fully.lcm module After filling liquid crystal into the box can be displayed properly.
Wear: A, test method: the PI-oriented film has completely dried additive ITO conductive glass production process parameters by directional friction five times.
B, criteria: a box after filling liquid crystal display properly.
Optical performance and reliability: A, test method: the test PI oriented film made into the glass and is now producing the PI oriented film made into glass by current production process parameters, choose a model made into a finished product and test its optical and reliable sexual performance
B, criteria: optical performance and reliability test results with the current production of PI-oriented film made of glass results considerably, and in the test product model within the required range.
PI-oriented film selection rules:
LCD display type selection is generally based on the corresponding pretilt PI: TN-LCD choose low pretilt angle PI, COG LCD Display selection of high pretilt angle PI.
PI guide layer for some special treatment process under the additional layers of the LCD, select the PI reference when additional layer characteristics to consider. BLACK MASK COLOR-STN and products to choose CF curing temperature is less than the decomposition temperature of the PI; using a flexible conductive film forming of the LCD, the curing temperature should be less than the softening point temperature flexible substrate PI.